CD00161566 Datasheet, PDF (85/105 Pages) STMicroelectronics – nullMedium-density performance line ARM-based 32-bit MCU

STM32F103x8, STM32F103xB
Package characteristics
Figure 45. LFBGA100 - 10 x 10 mm low profile fine pitch ball grid array package
outline
Z Seating plane
ddd Z
A4 A2
A1 A
E1
e
F
A1 ball A1 ball
X
identifier index area
E
A
F
D1
D
e
K
Y
10
1
BOTTOM VIEW
Øb (100 balls)
Ø eee M Z Y X
Ø fff M Z
TOP VIEW
H0_ME_V2
1. Drawing is not to scale.
Table 53. LFBGA100 - 10 x 10 mm low profile fine pitch ball grid array package
mechanical data
Symbol
millimeters
Min
Typ
Max
inches⁽¹⁾
Min
Typ
Max
A
A1
A2
A4
b
D
D1
E
E1
e
F
ddd
eee
fff
N (number of balls)
0.270
0.450
9.850
9.850
0.300
0.500
10.000
7.200
10.000
7.200
0.800
1.400
1.700
0.0106
0.800
0.550
10.150
0.0177
0.3878
10.150
0.3878
0.120
0.150
0.080
100
0.0118
0.0197
0.3937
0.2835
0.3937
0.2835
0.0315
0.0551
0.0669
0.0315
0.0217
0.3996
0.3996
0.0047
0.0059
0.0031
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