RX230 Datasheet, PDF (117/177 Pages) Renesas Technology Corp – 54-MHz 32-bit RX MCUs, built-in FPU, 88.56 DMIPS, up to 512-KB flash memory

RX230 Group, RX231 Group
5. Electrical Characteristics
5.3.3
Timing of Recovery from Low Power Consumption Modes
Table 5.28 Timing of Recovery from Low Power Consumption Modes (1)
Conditions: 1.8 V ≤ VCC = VCC_USB = AVCC0 ≤ 5.5 V, VSS = AVSS0 = VREFL0 = VSS_USB = 0 V, T_a = –40 to +105°C
Item
Symbol Min.
Typ.
Max.
Unit
Test
Conditions
Recovery time High-speed Crystal connected to Main clock oscillator t_SBYMC —
from software mode
main clock oscillator operating*²
standby mode*¹
External clock input Main clock oscillator t_SBYEX —
to main clock
operating*³
oscillator
Sub-clock oscillator operating
HOCO clock oscillator operating
LOCO clock oscillator operating
t_SBYSC
—
t_SBYHO —
t_SBYLO
—
2
3
35 50
650 800
40 55
40 55
ms Figure 5.34
μs
μs
μs
μs
Note 1.
Note 2.
Note 3.
The recovery time varies depending on the state of each oscillator when the WAIT instruction is executed. When multiple
oscillators are operating, the recovery time varies depending on the operating state of the oscillators that are not selected as the
system clock source. The above table applies when only the corresponding clock is operating.
When the frequency of the crystal is 20 MHz.
When the main clock oscillator wait control register (MOSCWTCR) is set to 04h.
When the frequency of the external clock is 20 MHz.
When the main clock oscillator wait control register (MOSCWTCR) is set to 00h.
Table 5.29 Timing of Recovery from Low Power Consumption Modes (2)
Conditions: 1.8 V ≤ VCC = VCC_USB = AVCC0 ≤ 5.5 V, VSS = AVSS0 = VREFL0 = VSS_USB = 0 V, T_a = –40 to +105°C
Item
Symbol Min.
Typ.
Max.
Unit
Test
Conditions
Recovery time Middle-speed Crystal connected to Main clock oscillator t_SBYMC —
from software mode
main clock oscillator operating*²
standby mode*¹
Main clock oscillator t_SBYPC —
and PLL circuit
operating*³
External clock input Main clock oscillator t_SBYEX —
to main clock
operating*⁴
oscillator
Main clock oscillator t_SBYPE —
and PLL circuit
operating*⁵
Sub-clock oscillator operating
HOCO clock oscillator operating*⁶
LOCO clock oscillator operating
t_SBYSC
—
t_SBYHO —
t_SBYLO
—
2
3
2
3
3
4
65 85
600 750
40 50
5
7
ms Figure 5.34
ms
μs
μs
μs
μs
μs
Note 1.
Note 2.
Note 3.
Note 4.
Note 5.
Note 6.
The recovery time varies depending on the state of each oscillator when the WAIT instruction is executed. When multiple
oscillators are operating, the recovery time varies depending on the operating state of the oscillators that are not selected as the
system clock source. The above table applies when only the corresponding clock is operating.
When the frequency of the crystal is 12 MHz.
When the main clock oscillator wait control register (MOSCWTCR) is set to 04h.
When the frequency of PLL is 12 MHz.
When the main clock oscillator wait control register (MOSCWTCR) is set to 04h.
When the frequency of the external clock is 12 MHz.
When the main clock oscillator wait control register (MOSCWTCR) is set to 00h.
When the frequency of PLL is 12 MHz.
When the main clock oscillator wait control register (MOSCWTCR) is set to 00h.
This is the case when HOCO is selected as the system clock and its frequency division is set to be 8 MHz.
R01DS0261EJ0110 Rev.1.10
Oct 30, 2015
Page 117 of 177