UPD78F4216A Datasheet, PDF (49/60 Pages) NEC – MOS INTEGRATED CIRCUIT

µPD78F4216A, 78F4218A, 78F4216AY, 78F4218AY
9. RECOMMENDED SOLDERING CONDITIONS
The µPD78F4218AY should be soldered and mounted under the following recommended conditions. For the
details of the recommended soldering conditions, refer to the document Semiconductor Device Mounting
Technology Manual (C10535E).
For soldering methods and conditions other than those recommended below, contact your NEC sales
representative.
Table 9-1. Surface Mounting Type Soldering Conditions
(1) µPD78F4216AGC-8EU:100-pin plastic LQFP (fine pitch) (14 × 14)
µPD78F4218AGC-8EU:100-pin plastic LQFP (fine pitch) (14 × 14)
µPD78F4216AYGC-8EU:100-pin plastic LQFP (fine pitch) (14 × 14)
µPD78F4218AYGC-8EU: 100-pin plastic LQFP (fine pitch) (14 × 14)
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or higher),
Count: Two times or less, Exposure limit: 7 days^Note (after that, prebake at 125°C
for 10 hours)
IR35-107-2
VPS
Package peak temperature: 215°C, Time: 40 seconds max. (at 200°C or higher),
Count: Two times or less, Exposure limit: 7 days^Note (after that, prebake at 125°C
for 10 hours)
VP15-107-2
Partial heating
Pin temperature: 300°C max., Time: 3 seconds max. (per pin row)
−
Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
(2) µPD78F4216AGF-3BA:100-pin plastic QFP (14 × 20)
µPD78F4218AGF-3BA:100-pin plastic QFP (14 × 20)
µPD78F4216AYGF-3BA:100-pin plastic QFP (14 × 20)
µPD78F4218AYGF-3BA: 100-pin plastic QFP (14 × 20)
Soldering Method
Infrared reflow
VPS
Wave soldering
Partial heating
Soldering Conditions
Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or higher),
Count: Two times or less
Package peak temperature: 215°C, Time: 40 seconds max. (at 200°C or higher),
Count: Two times or less
Solder bath temperature: 260°C max., Time: 10 seconds max., Count: Once,
Preheating temperature: 120°C max. (package surface temperature)
Pin temperature: 300°C max., Time: 3 seconds max. (per pin row)
Recommended
Condition Symbol
IR35-00-2
VP15-00-2
WS60-00-1
−
Caution Do not use different soldering methods together (except for partial heating).
Data Sheet U14125EJ1V0DS00
49