MT9V112 Datasheet, PDF (57/58 Pages) Micron Technology – SOC VGA DIGITAL IMAGE SENSOR

PRELIMINARY
MT9V112
SOC VGA DIGITAL IMAGE SENSOR
Figure 25: 36-Ball ICSP Package
0.95 (FOR REFERENCE ONLY)
1.17 ±0.10
SEATING PLANE
0.10
A
B
0.22
(FOR REFERENCE ONLY)
36X Ø0.35
DIMENSIONS APPLY TO
SOLDER BALLS POST
REFLOW. THE PRE-REFLOW
DIAMETER IS Ø0.33
3.75
0.75 TYP
BALL A6
0.175
(FOR REFERENCE ONLY)
0.575 ±0.050
0.375 ±0.075
BALL A1
BALL A1 ID
2.90 ±0.05
BALL A1
CORNER
4.00
CTR
2.900 ±0.075
2.714 ±0.075
PIXEL
(0,0)
3.75
1.875
CL
5.80 ±0.075
0.75 TYP
CL
1.875
2.90 ±0.05
5.80 ±0.075
SOLDER BALL MATERIAL:
62% Sn, 36% Pb, 2% Ag OR
96.5% Sn, 3% Ag, 0.5% Cu
BALL PADS Ø 0.27 SOLDER MASK DEFINED
SUBSTRATE MATERIAL: PLASTIC LAMINATE
ENCAPSULANT: EPOXY
0.186
(FOR REFERENCE ONLY)
OPTICAL CENTER
PACKAGE CENTER
1.728
CTR ^4.00
CTR
OPTICAL AREA
2.304 CTR
MAXIMUM ROTATION OF OPTICAL AREA RELATIVE TO PACKAGE EDGES: 1º
MAXIMUM TILT OF OPTICAL AREA RELATIVE TO B 0.3º.
MAXIMUM TILT OF OPTICAL AREA RELATIVE TO TOP OF COVER GLASS: 0.3º.
LID MATERIAL: BOROSILICATE GLASS 0.40 THICKNESS
IMAGE SENSOR DIE
NOTE:
All dimensions in millimeters.
Data Sheet Designation
Preliminary This data sheet contains initial characterization limits that are subject to change upon full charac-
terization of production devices.
®
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MT9V112_2.fm - Rev. A 1/05 EN
57
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