PIC16F872_06 Datasheet, PDF (156/168 Pages) Microchip Technology – 28-Pin, 8-Bit CMOS Flash Microcontroller with 10-Bit A/D

PIC16F872
28-Lead Plastic Shrink Small Outline (SS) – 209 mil Body, 5.30 mm (SSOP)
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
E
E1
p
B
n
D
2
1
A
c
A2
φ
A1
L
Units
INCHES
MILLIMETERS*
Dimension Limits
MIN
NOM
MAX
MIN
NOM
MAX
Number of Pins
Pitch
n
28
p
.026
28
0.65
Overall Height
A
-
-
.079
-
-
2.00
Molded Package Thickness
A2
.065
.069
.073
1.65
1.75
1.85
Standoff
A1
.002
-
-
0.05
-
-
Overall Width
E
.295
.307
.323
7.49
7.80
8.20
Molded Package Width
E1
.197
.209
.220
5.00
5.30
5.60
Overall Length
D
.390
.402
.413
9.90
10.20
10.50
Foot Length
L
.022
.030
.037
0.55
0.75
0.95
Lead Thickness
c
.004
-
.010
0.09
-
0.25
Foot Angle
φ
0°
4°
8°
0°
4°
8°
Lead Width
B
.009
-
.015
0.22
-
0.38
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.
Drawing No. C04-073
Revised 1-12-06
DS30221C-page 154
© 2006 Microchip Technology Inc.