PIC16F872_06 Datasheet, PDF (121/168 Pages) Microchip Technology – 28-Pin, 8-Bit CMOS Flash Microcontroller with 10-Bit A/D

PIC16F872
14.1 DC Characteristics: PIC16F872 (Commercial, Industrial)
PIC16LF872 (Commercial, Industrial)
PIC16LF872 (Commercial, Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for industrial
0°C ≤ TA ≤ +70°C for commercial
PIC16F872 (Commercial, Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for industrial
0°C ≤ TA ≤ +70°C for commercial
Param Symbol
No.
Characteristic/
Device
Min Typ† Max Units
Conditions
VDD
Supply Voltage
D001
PIC16LF872 2.2
— 5.5
V LP,XT,RC osc configuration
(DC to 4 MHz)
D001
PIC16F872 4.0 — 5.5 V LP, XT, RC osc configuration
D001A
D001A
PIC16LF872 4.5
PIC16F872 VBOR
5.5 V HS osc configuration
5.5 V BOR enabled, FMAX = 14 MHz⁽⁷⁾
D002 VDR
RAM Data Retention
Voltage⁽¹⁾
— 1.5 — V
D003 VPOR VDD Start Voltage to
— VSS —
ensure internal Power-on
Reset signal
V See section on Power-on Reset for details
D004 SVDD
VDD Rise Rate to ensure 0.05 —
internal Power-on Reset
signal
— V/ms See section on Power-on Reset for details
D005 VBOR
IDD
Brown-out Reset
Voltage
Supply Current^(2,5)
3.7 4.0 4.35 V BODEN bit in configuration word enabled
D010
PIC16LF872 —
0.6 2.0 mA XT, RC osc configuration
FOSC = 4 MHz, VDD = 3.0V
D010
PIC16F872 — 1.6 4 mA RC osc configurations
FOSC = 4 MHz, VDD = 5.5V
D010A
PIC16LF872 —
20 35 μA LP osc configuration
FOSC = 32 kHz, VDD = 3.0V, WDT disabled
D013
PIC16F872 —
7 15 mA HS osc configuration,
FOSC = 20 MHz, VDD = 5.5V
Legend: Rows with standard voltage device data only are shaded for improved readability.
† Data is “Typ” column is at 5V, 25°C, unless otherwise stated. These parameters are for design guidance only,
and are not tested.
Note 1: This is the limit to which VDD can be lowered without losing RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O pin
loading and switching rate, oscillator type, internal code execution pattern and temperature, also have an
impact on the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD
MCLR = VDD; WDT enabled/disabled as specified.
3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is mea-
sured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.
4: For RC osc configuration, current through REXT is not included. The current through the resistor can be esti-
mated by the formula Ir = VDD/2REXT (mA) with REXT in kOhm.
5: Timer1 oscillator (when enabled) adds approximately 20 μA to the specification. This value is from character-
ization and is for design guidance only. This is not tested.
6: The Δ current is the additional current consumed when this peripheral is enabled. This current should be
added to the base IDD or IPD measurement.
7: When BOR is enabled, the device will operate correctly until the VBOR voltage trip point is reached.
© 2006 Microchip Technology Inc.
DS30221C-page 119