PIC16F872_06 Datasheet, PDF (155/168 Pages) Microchip Technology – 28-Pin, 8-Bit CMOS Flash Microcontroller with 10-Bit A/D

PIC16F872
28-Lead Plastic Small Outline (SO) – Wide, 300 mil Body (SOIC)
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
E
E1
p
D
B
2
n
1
h
45°
c
A
α
A2
φ
β
L
A1
Units
INCHES*
MILLIMETERS
Dimension Limits MIN
NOM
MAX
MIN
NOM
MAX
Number of Pins
Pitch
n
28
p
.050
28
1.27
Overall Height
A
.093
.099
.104
2.36
2.50
2.64
Molded Package Thickness
A2
.088
.091
.094
2.24
2.31
2.39
Standoff
§
A1
.004
.008
.012
0.10
0.20
0.30
Overall Width
E
.394
.407
.420
10.01
10.34
10.67
Molded Package Width
E1
.288
.295
.299
7.32
7.49
7.59
Overall Length
D
.695
.704
.712
17.65
17.87
18.08
Chamfer Distance
h
.010
.020
.029
0.25
0.50
0.74
Foot Length
Foot Angle Top
L
.016
.033
.050
0.41
0.84
1.27
φ
0
4
8
0
4
8
Lead Thickness
c
.009
.011
.013
0.23
0.28
0.33
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
B
.014
.017
.020
0.36
0.42
0.51
α
0
12
15
0
12
15
β
0
12
15
0
12
15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC Equivalent: MS-013
Drawing No. C04-052
© 2006 Microchip Technology Inc.
DS30221C-page 153