PIC16F872_06 Datasheet, PDF (125/168 Pages) Microchip Technology – 28-Pin, 8-Bit CMOS Flash Microcontroller with 10-Bit A/D

PIC16F872
14.3 DC Characteristics: PIC16F872 (Extended)
PIC16F872 (Extended)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +125°C
Param Symbol
No.
Characteristic/
Device
Min Typ† Max Units
Conditions
VDD
Supply Voltage
D001
4.0 — 5.5 V LP, XT, RC osc configuration
D001A
D001A
4.5
VBOR
5.5 V HS osc configuration
5.5
V BOR enabled, FMAX = 14 MHz⁽⁷⁾
D002
VDR
RAM Data Retention
Voltage⁽¹⁾
— 1.5 —
V
D003
VPOR VDD Start Voltage to
— VSS —
ensure internal Power-on
Reset signal
V See section on Power-on Reset for
details
D004
SVDD VDD Rise Rate to ensure 0.05 —
internal Power-on Reset
signal
— V/ms See section on Power-on Reset for
details
D005
VBOR
Brown-out Reset
Voltage
3.7 4.0 4.35 V BODEN bit in configuration word
enabled
IDD
Supply Current^(2,5)
D010
— 1.6 4 mA RC osc configurations
FOSC = 4 MHz, VDD = 5.5V
D013
—
7
15 mA HS osc configuration,
FOSC = 20 MHZ, VDD = 5.5V
D015 ΔIBOR Brown-out
Reset Current⁽⁶⁾
— 85 200 μA BOR enabled, VDD = 5.0V
IPD
Power-down
Current^(3,5)
D020A
10.5 60 μA VDD = 4.0V, WDT enabled
D021B
1.5 30 μA VDD = 4.0V, WDT disabled
D023
ΔIBOR Brown-out
Reset Current⁽⁶⁾
— 85 200 μA BOR enabled, VDD = 5.0V
† Data in “Typ” column is at 5V, 25°C, unless otherwise stated. These parameters are for design guidance only,
and are not tested.
Note 1: This is the limit to which VDD can be lowered without losing RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O pin
loading and switching rate, oscillator type, internal code execution pattern and temperature also have an
impact on the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD
MCLR = VDD; WDT enabled/disabled as specified.
3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is
measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.
4: For RC osc configuration, current through REXT is not included. The current through the resistor can be esti-
mated by the formula Ir = VDD/2REXT (mA) with REXT in kOhm.
5: Timer1 oscillator (when enabled) adds approximately 20 μA to the specification. This value is from charac-
terization and is for design guidance only. This is not tested.
6: The Δ current is the additional current consumed when this peripheral is enabled. This current should be
added to the base IDD or IPD measurement.
7: When BOR is enabled, the device will operate correctly until the VBOR voltage trip point is reached.
© 2006 Microchip Technology Inc.
DS30221C-page 123