LAN8740A Datasheet, PDF (129/136 Pages) Microchip Technology – Small Footprint MII/RMII 10/100 Energy Efficient Ethernet Transceiver with HP Auto-MDIX and flexPWR® Technology

LAN8740A/LAN8740Ai
32-Lead Very Thin Plastic Quad Flat, No Lead Package (MQ) - 5x5mm Body [VQFN]
SMSC LEGACY SQFN
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
C1
X2
EV
32
1
2
C2 Y2
EV
ØV
G2
G1
Y1
X1
E
RECOMMENDED LAND PATTERN
SILK SCREEN
Units
Dimension Limits
Contact Pitch
E
Optional Center Pad Width
X2
Optional Center Pad Length
Y2
Contact Pad Spacing
C1
Contact Pad Spacing
C2
Contact Pad Width (X32)
X1
Contact Pad Length (X32)
Y1
Contact Pad to Center Pad (X32) G1
Contact Pad to Contactr Pad (X28) G2
Thermal Via Diameter
V
Thermal Via Pitch
EV
MILLIMETERS
MIN
NOM
MAX
0.50 BSC
3.40
3.40
4.90
4.90
0.30
0.85
0.33
0.20
0.33
1.20
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
2. For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
Microchip Technology Drawing C04-2160C SQFN
 2013-2015 Microchip Technology Inc.
DS00001987A-page 129