MV78100 Datasheet, PDF (64/124 Pages) –

MV78100
Hardware Specifications
9.3
Thermal Power Dissipation (Preliminary)
.
Table 25: Thermal Power Dissipation
Interface
Core
Embedded CPU
RGMII 1.8V interface
DDR2 DIMM interface (72-bit) ODT
Miscellaneous
(Device Bus interface, TWSI, JTAG, MPP,
SPI, UART)
PCI Express interface
Symbol
P_VDD
P_{VDD_CPU}
P_{VDD_GE}
P_{VDD_M}
P_MISC
P_PEX
USB interface
SATA interface
P_USB
P_SATA
Test Conditions
1 GHz, VDD_CPU=1.1V
One Port, VDD_GE=1.8V
M_CLK=333 MHz
Ty p
1200
2100
90
1675
300
Units
mW
mW
mW
mW
mW
For one PCI Express interface in x4
400
mW
mode
For one USB port
70
mW
For one SATA port
180
mW
Notes:
1. The values are for nominal voltage.
2. Trace load is 5 pF unless otherwise specified.
3. Power in mW is calculated using the typical recommended VDDIO specification for each power
rail.
MV-S104552-U0 Rev. D
Page 64
Document Classification: Proprietary Information
Copyright © 2008 Marvell
December 6, 2008, Preliminary