MV78100 Datasheet, PDF (116/124 Pages) –

MV78100
Hardware Specifications
10
Thermal Data (Preliminary)
Table 61 provides the package thermal data for the MV78100. This data is derived from simulations
that were run according to the JEDEC standard.
Note
The thermal parameters are preliminary and subject to change.
The documents listed below provide a basic understanding of thermal management of integrated
circuits (ICs) and guidelines to ensure optimal operating conditions for Marvell^® products. Before
designing a system it is recommended to refer to these documents:
„ Application Note, AN-63 Thermal Management for Selected Marvell^® Products (Doc. No.
MV-S300281-00)
„ White Paper, ThetaJC, ThetaJA, and Temperature Calculations(Doc. No. MV-S700019-00)
Table 61: Thermal Data for the MV78100 in FCBGA Package
Symbol Definition
θ_JA
Thermal resistance: junction to ambient
ψ_JT
Thermal characterization parameter: junction to top center
ψ_JB
Thermal characterization parameter: junction to board
θ_JC
Thermal resistance: junction to case
(not air-flow dependent)
θ_JB
Thermal resistance: junction to board
(not air-flow dependent)
Airflow Value (C/W)
0[m/s]
1[m/s]
2[m/s]
17.4
15.6
14.8
0.8
0.8
0.8
10.2
9.9
9.7
0.4
14.5
MV-S104552-U0 Rev. D
Page 116
Document Classification: Proprietary Information
Copyright © 2008 Marvell
December 6, 2008, Preliminary