AC82GL40-SLB95 Datasheet, PDF (97/98 Pages) Intel Corporation – Intel® Celeron® Mobile Processor Dual-Core on 45-nm Process

1 Introduction .............................................................................................................. 7
1.1 Terminology ....................................................................................................... 8
1.2 References ......................................................................................................... 9
2 Low Power Features ................................................................................................ 11
2.1 Clock Control and Low Power States .................................................................... 11
2.1.1 Core Low-Power States ........................................................................... 12
2.1.1.1
2.1.1.2
2.1.1.3
2.1.1.4
2.1.1.5
2.1.1.6
C0 State .................................................................................. 12
C1/AutoHALT Powerdown State .................................................. 12
C1/MWAIT Powerdown State ...................................................... 13
Core C2 State........................................................................... 13
Core C3 State........................................................................... 13
Core C4 State........................................................................... 13
2.1.2 Package Low-Power States ...................................................................... 13
2.1.2.1
2.1.2.2
2.1.2.3
2.1.2.4
2.1.2.5
2.1.2.6
Normal State............................................................................ 13
Stop-Grant State ...................................................................... 13
Stop Grant Snoop State ............................................................. 14
Sleep State .............................................................................. 14
Deep Sleep State ...................................................................... 15
Deeper Sleep State ................................................................... 15
2.2 Enhanced Intel SpeedStep® Technology .............................................................. 15
2.3 Low-Power FSB Features .................................................................................... 16
2.4 Processor Power Status Indicator (PSI#) Signal..................................................... 17
3 Electrical Specifications ........................................................................................... 19
3.1 Power and Ground Pins ...................................................................................... 19
3.2 FSB Clock (BCLK[1:0]) and Processor Clocking ...................................................... 19
3.3 Voltage Identification ......................................................................................... 19
3.4 Catastrophic Thermal Protection .......................................................................... 22
3.5 Reserved and Unused Pins.................................................................................. 22
3.6 FSB Frequency Select Signals (BSEL[2:0])............................................................ 23
3.7 FSB Signal Groups............................................................................................. 23
3.8 CMOS Signals ................................................................................................... 25
3.9 Maximum Ratings.............................................................................................. 25
3.10 Processor DC Specifications ................................................................................ 26
4 Package Mechanical Specifications and Pin Information .......................................... 33
4.1 Package Mechanical Specifications ....................................................................... 33
4.2 Processor Pinout and Pin List .............................................................................. 39
4.3 Alphabetical Signals Reference ............................................................................ 75
5 Thermal Specifications and Design Considerations .................................................. 83
5.1 Monitoring Die Temperature ............................................................................... 84
5.1.1 Thermal Diode ....................................................................................... 85
5.1.2 Thermal Diode Offset .............................................................................. 87
5.1.3 Intel® Thermal Monitor........................................................................... 88
5.1.4 Digital Thermal Sensor............................................................................ 89
5.1.5 Out of Specification Detection .................................................................. 90
5.1.6 PROCHOT# Signal Pin ............................................................................. 90
Datasheet
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