AC82GL40-SLB95 Datasheet, PDF (34/98 Pages) Intel Corporation – Intel® Celeron® Mobile Processor Dual-Core on 45-nm Process

Package Mechanical Specifications and Pin Information
Figure 3.
h
4-MB and Fused 2-MB Micro-FCPGA Processor Package Drawing (Sheet 1 of 2)
B
B₁
G₁
H₁
C₂
B₂
G₂
H₂
C₁
Top View
A
J2
J1 _{Bottom View}
478 Pins
A
Front View
Die
Underfill
Package Substrate
0.37 MAX
0.65 MAX
P
Detail A
Scale 20
Side View
F_{2 F3}
0.65 MAX
2.03±0.08 C
SYMBOL
B₁
B₂
C₁
C₂
F₂
F₃
G₁
G₂
MILLIMETERS
MIN MAX
34.95 35.05
34.95 35.05
10.5
13.8
0.89
1.903 2.163
31.75 BASIC
31.75 BASIC
H₁ 15.875 BASIC
H₂ 15.875 BASIC
J₁
1.27 BASIC
J₂
1.27 BASIC
P 0.255 0.355
P DIE
689 kPa
W
6g
Keying Pins
COMMENTS
øø00..325564
M
M
C
C
A
B
A1, B1
34
Datasheet