AC82GL40-SLB95 Datasheet, PDF (33/98 Pages) Intel Corporation – Intel® Celeron® Mobile Processor Dual-Core on 45-nm Process

Package Mechanical Specifications and Pin Information
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4.1
Note:
Package Mechanical
Specifications and Pin
Information
Package Mechanical Specifications
The processor is available in a 1-MB, 478-pin Micro-FCPGA package. The package
mechanical dimensions, keep-out zones, processor mass specifications, and package
loading specifications are shown in Figure 3 through Figure 6.
The SFF processor (ULV DC) is available 956-ball Micro-FCBGA packages. The package
mechanical dimensions are shown in Figure 7.
The maximum outgoing co-planarity is 0.2 mm (8 mils) for SFF Package
The mechanical package pressure specifications are in a direction normal to the surface
of the processor. This requirement is to protect the processor die from fracture risk due
to uneven die pressure distribution under tilt, stack-up tolerances and other similar
conditions. These specifications assume that a mechanical attach is designed
specifically to load one type of processor.
Moreover, the processor package substrate should not be used as a mechanical
reference or load-bearing surface for the thermal or mechanical solution. Please refer
to the Santa Rosa Platform Mechanical Design Guide for more details.
For M-step based processors refer to the 2-MB package drawings.
Datasheet
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