AC82GL40-SLB95 Datasheet, PDF (3/98 Pages) Intel Corporation – Intel® Celeron® Mobile Processor Dual-Core on 45-nm Process

Contents
1 Introduction .............................................................................................................. 7
1.1 Terminology ....................................................................................................... 8
1.2 References ......................................................................................................... 9
2 Low Power Features ................................................................................................ 11
2.1 Clock Control and Low Power States .................................................................... 11
2.1.1 Core Low-Power States ........................................................................... 12
2.1.2 Package Low-Power States ...................................................................... 13
2.2 Low-Power FSB Features .................................................................................... 15
2.3 Processor Power Status Indicator (PSI#) Signal..................................................... 15
3 Electrical Specifications ........................................................................................... 17
3.1 Power and Ground Pins ...................................................................................... 17
3.2 FSB Clock (BCLK[1:0]) and Processor Clocking ...................................................... 17
3.3 Voltage Identification ......................................................................................... 17
3.4 Catastrophic Thermal Protection .......................................................................... 20
3.5 Reserved and Unused Pins.................................................................................. 20
3.6 FSB Frequency Select Signals (BSEL[2:0])............................................................ 21
3.7 FSB Signal Groups............................................................................................. 21
3.8 CMOS Signals ................................................................................................... 23
3.9 Maximum Ratings.............................................................................................. 23
3.10 Processor DC Specifications ................................................................................ 24
4 Package Mechanical Specifications and Pin Information .......................................... 29
4.1 Package Mechanical Specifications ....................................................................... 29
4.2 Processor Pinout and Pin List .............................................................................. 33
4.3 Alphabetical Signals Reference ............................................................................ 53
5 Thermal Specifications and Design Considerations .................................................. 61
5.1 Monitoring Die Temperature ............................................................................... 61
5.1.1 Thermal Diode ....................................................................................... 62
5.1.2 Thermal Diode Offset .............................................................................. 64
5.1.3 Intel® Thermal Monitor........................................................................... 65
5.1.4 Digital Thermal Sensor............................................................................ 66
5.1.5 Out of Specification Detection .................................................................. 67
5.1.6 PROCHOT# Signal Pin ............................................................................. 67
Datasheet
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