AC82GL40-SLB95 Datasheet, PDF (84/98 Pages) Intel Corporation – Intel® Celeron® Mobile Processor Dual-Core on 45-nm Process

Thermal Specifications and Design Considerations
3.
As measured by the activation of the on-die Intel Thermal Monitor. The Intel Thermal Monitor’s automatic
mode is used to indicate that the maximum T_J has been reached. Refer to Section 5.1 for details.
4.
The Intel Thermal Monitor automatic mode must be enabled for the processor to operate within
specifications.
5.
At Tj of 100 ^oC
6.
At Tj of 50 ^oC
7.
At Tj of 35 ^oC
8.
512-KB L2 cache
Table 25.
Power Specifications for the Ultra Low Voltage Dual-Core 1M Cache Intel
Celeron (SFF) Genuine Intel Processor
Symbol
TDP
Symbol
P_AH,
P_SGNT
P_SLP
P_DSLP
P_DPRSLP
T_J
Processor
Number
Core Frequency
SU2300
1.2 GHz
Parameter
Auto Halt, Stop Grant Power
Sleep Power
Deep Sleep Power
Deeper Sleep Power
Junction Temperature
Thermal Design
Power
Unit
10
W
Min Typ Max Unit
2.9 W
2.9 W
1.3 W
0.6 W
0
100 °C
Notes
1, 4, 5
Notes
2, 6
2, 6
2,7
2, 7
3,4
NOTES:
1.
The TDP specification should be used to design the processor thermal solution. The TDP is not the
maximum theoretical power the processor can generate.
2.
Not 100% tested. These power specifications are determined by characterization of the processor currents
at higher temperatures and extrapolating the values for the temperature indicated.
3.
As measured by the activation of the on-die Intel Thermal Monitor. The Intel Thermal Monitor’s automatic
mode is used to indicate that the maximum T_J has been reached. Refer to Section 5.1 for more details.
4.
The Intel Thermal Monitor automatic mode must be enabled for the processor to operate within
specifications.
5.
At Tj of 100 ^oC
6.
At Tj of 50 °C
7.
At Tj of 35 ^oC
5.1
Monitoring Die Temperature
The processor incorporates three methods of monitoring die temperature:
• Thermal Diode
• Intel Thermal Monitor
• Digital Thermal Sensor
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Datasheet