AC82GL40-SLB95 Datasheet, PDF (28/98 Pages) Intel Corporation – Intel® Celeron® Mobile Processor Dual-Core on 45-nm Process

Electrical Specifications
Table 7.
DC Voltage and Current Specifications for the T1x00 Celeron Mobile
Processors
Symbol
Parameter
Min
Typ
Max
Unit Notes
V_CC
V_CC,BOOT
V_CCP
V_CCA
I_CCDES
I_CC
I_AH,
I_SGNT
I_SLP
I_DSLP
dI_CC/DT
I_CCA
I_CCP
V_CC of the Processor Core
Default V_CC Voltage for Initial Power Up
AGTL+ Termination Voltage
PLL Supply Voltage
I_CC for processors
Recommended Design Targets:
I_CC for processors
Processor
Number
Frequency
Die Variant
T1600
1.66 GHz
1 MB
T1700
1.83 GHz
1 MB
I_CC Auto-Halt & Stop-Grant
I_CC Sleep
I_CC Deep Sleep
V_CC Power Supply Current Slew Rate at
CPU Package Pin
I_CC for V_CCA Supply
I_CC for V_CCP Supply before V_CC Stable
I_CC for V_CCP Supply after V_CC Stable
0.95
1.00
1.425
1.15
1.20
1.05
1.5
1.30
V
1, 2
V
2, 8
1.10
V
1.575
V
36
A
5
A
41
41
21
20.5
18.6
600
130
4.5
2.5
A
3, 4
A
3, 4
A
3, 4
A
3, 4
A
3, 4
A/µs
6, 7
mA
A
9
A
10
NOTES:
1.
Each processor is programmed with a maximum valid voltage identification value (VID), which is set at
manufacturing and cannot be altered. Individual maximum VID values are calibrated during manufacturing
in such a way that two processors at the same frequency may have different settings within the VID range.
Note that this differs from the VID employed by the processor during a power management event (Intel
Thermal Monitor 2, or Extended Halt State).
2.
The voltage specifications are assumed to be measured across V_{CC_SENSE} and V_{SS_SENSE} pins at socket with
a 100-MHz bandwidth oscilloscope, 1.5-pF maximum probe capacitance, and 1-mΩ minimum impedance.
The maximum length of ground wire on the probe should be less than 5 mm. Ensure external noise from
the system is not coupled in the scope probe.
3.
Specified at 100 °C Tj.
4.
Specified at the nominal V_CC.
5.
667-MHz FSB supported
6.
Instantaneous current I_{CC_CORE_INST} of 55 A has to be sustained for short time (t_INST) of 10 µs. Average
current is less than maximum specified I_CCDES. VR OCP threshold should be high enough to support current
levels described herein.
7.
Measured at the bulk capacitors on the motherboard.
8.
Based on simulations and averaged over the duration of any change in current. Specified by design/
characterization at nominal V_CC. Not 100% tested.
9.
This is a power-up peak current specification, which is applicable when V_CCP is high and V_{CC_CORE} is low.
10. This is a steady-state I_CC current specification, which is applicable when both V_CCP and V_{CC_CORE} are high.
11. 512-KB L2 cache.
28
Datasheet