AC82GL40-SLB95 Datasheet, PDF (30/98 Pages) Intel Corporation – Intel® Celeron® Mobile Processor Dual-Core on 45-nm Process

Electrical Specifications
5.
800-MHz FSB supported
6.
Measured at the bulk capacitors on the motherboard.
7.
Based on simulations and averaged over the duration of any change in current. Specified by design/
characterization at nominal V_CC. Not 100% tested.
8.
This is a power-up peak current specification, which is applicable when V_CCP is high and V_CC core is low.
9.
This is a steady-state Icc current specification, which is applicable when both V_CCP and V_CC core are high.
10. SU2300 processor operates at same core frequency in HFM and LFM.
Table 9.
FSB Differential BCLK Specifications
Symbol
Parameter
V_CROSS
ΔV_CROSS
V_SWING
I_LI
Cpad
Crossing Voltage
Range of Crossing Points
Differential Output Swing
Input Leakage Current
Pad Capacitance
Min
0.3
300
-5
0.95
Typ
1.2
Max
0.55
140
+5
1.45
Unit
V
mV
mV
µA
pF
Notes¹
2, 7, 8
2, 7, 5
6
3
4
1.
Unless otherwise noted, all specifications in this table apply to all processor frequencies.
2.
Crossing Voltage is defined as absolute voltage where rising edge of BCLK0 is equal to the
falling edge of BCLK1.
3.
For Vin between 0 V and V_IH.
4.
Cpad includes die capacitance only. No package parasitics are included.
5.
ΔV_CROSS is defined as the total variation of all crossing voltages as defined in Note 2.
6.
Measurement taken from differential waveform.
7.
Measurement taken from single-ended waveform.
8.
Only applies to the differential rising edge (Clock rising and Clock# falling).
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Datasheet