PXD10 Datasheet, PDF (68/130 Pages) Lumins Inc. – 4” Dia.X 6” extruded aluminum step poles

Electrical characteristics
V_DDR
Part
BCP68
BCX68
BC817
BCP56
VRC_CTRL
20 k
V_DD12
Figure 5. External NPN ballast connections
Table 19. Allowed ballast components
Manufacturer
Recommended derivative
ON, IFX, NXP, Fairchild, ST, etc.
IFX
ON, IFX, NXP, Fairchild, etc.
ON, IFX, NXP, Fairchild, ST, etc.
BCP68
BCX68-10
BCX68-16
BC817Su
BC817-25
BCP68-10
BCP68-16
Table 20. Ballast component parameters
Parameter
Capacitance on VDDR
Stability capacitance on VDD12
Decoupling capacitance on VDD12
Base resistor
Specification
10 F (minimum)
Place close to NPN collector
40 F (minimum)
Place close to NPN emitter
100 nF  number of pins (minimum)
Place on each VDD12/VSS12 pair and on the PLL
supply/ground pair
20 k
The capacitor values listed in Table 20 include a de-rating factor of 40%, covering tolerance, temperature,
and aging effects. These factors are taken into account to assure proper operation under worst-case
conditions. X7R type materials are recommended for all capacitors, based on ESR characteristics.
Large capacitors are for regulator stability and should be located near the external ballast transistor. The
number of capacitors is not important — only the overall capacitance value and the overall ESR value are
important.
Small capacitors are for power supply decoupling, although they do contribute to the overall capacitance
values. They should be located close to the device pin.
PXD10 Microcontroller Data Sheet, Rev. 1
68
Freescale Semiconductor