PXD10 Datasheet, PDF (65/130 Pages) Lumins Inc. – 4” Dia.X 6” extruded aluminum step poles

Electrical characteristics
The thermal characterization parameter is measured in compliance with the JESD51-2 specification using
a 40-gauge type T thermocouple epoxied to the top center of the package case. Position the thermocouple
so that the thermocouple junction rests on the package. Place a small amount of epoxy on the thermocouple
junction and approximately 1 mm of wire extending from the junction. Place the thermocouple wire flat
against the package case to avoid measurement errors caused by the cooling effects of the thermocouple
wire.
References:
Semiconductor Equipment and Materials International
805 East Middlefield Rd.
Mountain View, CA 94043 USA
[phone]
MIL-SPEC and EIA/JESD (JEDEC) specifications are available from Global Engineering Documents at
800-854-7179 or 303-397-7956.
JEDEC specifications are available on the WEB at http://www.jedec.org.
3.6 Electromagnetic compatibility (EMC) characteristics
Susceptibility tests are performed on a sample basis during product characterization.
3.6.1 EMC requirements on board
The following practices help minimize noise in applications.
• Place a 100 nF capacitor between each of the V_DD12/V_SS12 supply pairs and also between the
V_DDPLL/V_SSPLL pair. The voltage regulator also requires stability capacitors for these supply pairs.
• Place a 10 F capacitor on VDDR.
• Isolate VDDR with ballast emitter to avoid voltage droop during STANDBY mode exit.
• Enable pad slew rate only as necessary to eliminate I/O noise:
— Enabling slew rate for SMD pads will reduce noise on motors.
— Disabling slew rate for non-SMD pads will reduce noise on non-SMD IOs.
• Enable PLL modulation (± 2%) for system clock.
• Place decoupling capacitors for all HV supplies close to the pins.
3.6.2 Designing hardened software to avoid noise problems
EMC characterization and optimization are performed at component level with a typical application
environment and simplified MCU software. It should be noted that good EMC performance is highly
dependent on the user application and the software in particular.
Therefore it is recommended that the user apply EMC software optimization and prequalification tests in
relation with the EMC level requested for his application.
• Software recommendations The software flowchart must include the management of runaway
conditions such as:
PXD10 Microcontroller Data Sheet, Rev. 1
Freescale Semiconductor
65