MC9S08EL32 Datasheet, PDF (353/356 Pages) Freescale Semiconductor, Inc – 8-Bit HCS08 Central Processor Unit (CPU)

Appendix B Ordering Information and Mechanical Drawings
Appendix B
Ordering Information and Mechanical Drawings
B.1 Ordering Information
This section contains ordering information for MC9S08EL32 Series and MC9S08SL16 Series devices.
Table B-1. Devices in the MC9S08EL32 Series and MC9S08SL16 Series
Device Number¹
FLASH
Memory
RAM
EEPROM
Available Packages²
MC9S08EL32
32,768
1024
512
MC9S08EL16
16,384
MC9S08SL16
16,384
512
256
MC9S08SL8
8,192
28-TSSOP, 20-TSSOP
1 _{See Table 1-1 for a complete description of modules included on each device.}
2 _{See Table B-2 for package information.}
B.1.1 Device Numbering Scheme
This device uses a smart numbering system. Refer to the following diagram to understand what each
element of the device number represents.
Status
- S = Auto Qualified
Main Memory Type
- 9 = Flash-based
Core
Family
- EL or SL
S 9 S08 EL n E1 C xx R
Memory Size
- 32 Kbytes
- 16 Kbytes
Tape and Reel Suffix (optional)
- R = Tape and Reel
Package Designator
Two letter descriptor (refer to
Table B-2).
Temperature Option
- C = –40 to 85 °C
- V = –40 to 105 °C
- M = –40 to 125 °C
Mask Set Identifier — this
field only appears in “Auto
Qualified” part numbers
- Alpha character references
wafer fab.
- Numeric character identifies
mask.
Figure B-1. MC9S08EL32 and MC9S08SL16 Device Numbering Scheme
MC9S08EL32 Series and MC9S08SL16 Series Data Sheet, Rev. 3
Freescale Semiconductor
355