MC9S08EL32 Datasheet, PDF (351/356 Pages) Freescale Semiconductor, Inc – 8-Bit HCS08 Central Processor Unit (CPU)

Appendix A Electrical Characteristics
Table A-16. Flash Characteristics (continued)
Num C
Characteristic
Symbol
Min
Typical
Max
Unit
EEPROM Program/erase endurance³
10
C
T_L to T_H = –40°C to + 0°C
T_L to T_H = 0°C to + 125°C
T = 25°C
10,000
—
n_EEPE
50,000
—
100,000
—
cycles
11
C _{Data retention}⁴
t_{D_ret}
15
100
—
years
1 _{The frequency of this clock is controlled by a software setting.}
2 _{These values are hardware state machine controlled. User code does not need to count cycles. This information supplied for}
calculating approximate time to program and erase.
3 _{Typical endurance for Flash is based upon the intrinsic bit cell performance. For additional information on how Freescale}
defines typical endurance, please refer to Engineering Bulletin EB619/D, Typical Endurance for Nonvolatile Memory.
4 _{Typical data retention values are based on intrinsic capability of the technology measured at high temperature and de-rated}
to 25°C using the Arrhenius equation. For additional information on how Freescale Semiconductor defines typical data
retention, please refer to Engineering Bulletin EB618/D, Typical Data Retention for Nonvolatile Memory.
A.14 EMC Performance
Electromagnetic compatibility (EMC) performance is highly dependant on the environment in which the
MCU resides. Board design and layout, circuit topology choices, location and characteristics of external
components as well as MCU software operation all play a significant role in EMC performance. The
system designer should consult Freescale applications notes such as AN2321, AN1050, AN1263,
AN2764, and AN1259 for advice and guidance specifically targeted at optimizing EMC performance.
A.14.1 Radiated Emissions
Microcontroller radiated RF emissions are measured from 150 kHz to 1 GHz using the TEM/GTEM Cell
method in accordance with the IEC 61967-2 and SAE J1752/3 standards. The measurement is performed
with the microcontroller installed on a custom EMC evaluation board while running specialized EMC test
software. The radiated emissions from the microcontroller are measured in a TEM cell in two package
orientations (North and East).
The maximum radiated RF emissions of the tested configuration in all orientations are less than or equal
to the reported emissions levels.
Table A-17. Radiated Emissions, Electric Field
Parameter
Symbol Conditions
Frequency
f_OSC/f_BUS
Level¹
(Max)
Unit
Radiated emissions,
electric field
0.15 – 50 MHz
11
50 – 150 MHz
12
V_{RE_TEM}
V_DD = 5.0V
T_A = +25^oC
package type
150 – 500 MHz
500 – 1000 MHz
4MHz crystal
20MHz bus
3
−10
28 TSSOP
IEC Level
N/A
SAE Level
2
dBμV
—
—
MC9S08EL32 Series and MC9S08SL16 Series Data Sheet, Rev. 3
Freescale Semiconductor
353