IBIS4-A-6600 Datasheet, PDF (38/40 Pages) Cypress Semiconductor – 6.6 MP CMOS Image Sensor

ADVANCE
INFORMATION
IBIS4-A-6600
CYII4SM6600AB
Figure 31. Reflow Soldering Temperature Profile
RoHS (lead free) Compliance
This paragraph reports the use of Hazardous chemical
substances as required by the RoHS Directive (excluding
packing material).
Table 23. The Chemical Substances and Information about Any Intentional Content
Chemical Substance
Any intentional content
Lead
NO
Cadmium
NO
Mercury
NO
Hexavalent chromium
NO
PBB (Polybrominated biphenyls)
NO
PBDE (Polybrominated diphenyl ethers)
NO
If there is any intentional content, in
which portion is it contained?
-
-
-
-
-
-
Information on lead free soldering:
IBIS4-A-6600-M2 (serial numbers beyond 3694): the product
was tested successfully for lead-free soldering processes,
using a reflow temperature profile with maximum 260°C,
minimum 40s at 255°C and minimum 90s at 217°C.
IBIS4-A-6600-C2: the product will not withstand a lead free
soldering process. Maximum allowed reflow or wave soldering
temperature is 220°C. Hand soldering is recommended for this
part type.
Note:
"Intentional content" is defined as any material demanding
special attention is contained into the inquired product by
following cases:
1. A case that the above material is added as a chemical
composition into the inquired product intentionally in order
to produce and maintain the required performance and
function of the intended product
2. A case that the above material, which is used intentionally
in the manufacturing process, is contained in or adhered to
the inquired product
The following case is not treated as "intentional content":
1. A case that the above material is contained as an impurity
into raw materials or parts of the intended product. The
impurity is defined as a substance that cannot be removed
industrially, or it is produced at a process such as chemical
composing or reaction and it cannot be removed
technically.
Document Number: 001-02366 Rev. *D
Page 38 of 40
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