IBIS4-A-6600 Datasheet, PDF (32/40 Pages) Cypress Semiconductor – 6.6 MP CMOS Image Sensor

ADVANCE
INFORMATION
IBIS4-A-6600
CYII4SM6600AB
Packaging
Bare Die
The IBIS4-6600 image sensor has 68 pins, 17 pins on each
side. The die size from pad-edge to pad-edge (without
scribe-line) is 9120.10 ?m (X) by 11960.10 ?m (Y). Scribe lines
will take about 100 to 150 ?m extra on each side.
Pin 1 is located in the middle of the left side, indicated by a "1"
on the layout.
A logo and some identification tags can be found on the lower
right of the die (see Figure 25.).
Figure 25. Bare Die Dimensions
Pad 60
Bonding
Probe
Pad 44
Pad 61
Pad 43
7777.00 ȝm
(2222 * 3.5)
10549.00 ȝm
(3014 * 3.5)
Pad 1
Origin
(0,0)
4404.47 ȝm
Pixel array center
Test diodes
6427.00 ȝm
Probe
Bonding
Pixel 0,0
11960 10 ȝm
Bonding
Probe
Identification
Pad 9
Pad 10
Probe
Bonding _9120.10ȝm
Pad 27
Pad 26
Document Number: 001-02366 Rev. *D
Page 32 of 40
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