IBIS4-A-6600 Datasheet, PDF (37/40 Pages) Cypress Semiconductor – 6.6 MP CMOS Image Sensor

ADVANCE
INFORMATION
IBIS4-A-6600
CYII4SM6600AB
Glass Lid Specifications
Monochrome Sensor
D263 glass lid is 1.52. Figure 30. shows the transmission
characteristics of the D263 glass.
A D263 glass will be used as protection glass lid on top of the
IBIS4-6600 monochrome sensors. The refraction index of the
Figure 30. Transmittance Curve of the D263 Cover Glass Lid
100
90
80
70
60
50
40
30
20
10
0
400
500
600
700
800
900
Wavelength [nm]
Storage and Handling
Storage Conditions
Table 22. Storage conditions.
Description
Temperature
Minimum
–30
Maximum
+85
Maximum
°C
Handling and Soldering Conditions
Special care should be taken when soldering image sensors
with color filter arrays (RGB color filters), onto a circuit board,
since color filters are sensitive to high temperatures.
Prolonged heating at elevated temperatures may result in
deterioration of the performance of the sensor. The following
recommendations are made to ensure that sensor
performance is not compromised during end-users' assembly
processes.
Board Assembly:
Device placement onto boards should be done in accordance
with strict ESD controls for Class 0, JESD22 Human Body
Model, and Class A, JESD22 Machine Model devices.
Assembly operators should always wear all designated and
approved grounding equipment; grounded wrist straps at ESD
protected workstations are recommended including the use of
ionized blowers. All tools should be ESD protected.
Manual Soldering:
When a soldering iron is used the following conditions should
be observed:
Use a soldering iron with temperature control at the tip. The
soldering iron tip temperature should not exceed 350°C.
The soldering period for each pin should be less than 5
seconds.
Reflow Soldering:
Figure 31. shows the maximum recommended thermal profile
for a reflow soldering system. If the temperature/time profile
exceeds these recommendations damage to the image sensor
may occur. See Figure 31. for more details.
Precautions and cleaning:
Avoid spilling solder flux on the cover glass; bare glass and
particularly glass with antireflection filters may be adversely
affected by the flux. Avoid mechanical or particulate damage
to the cover glass.
It is recommended that isopropyl alcohol (IPA) is used as a
solvent for cleaning the image sensor glass lid. When using
other solvents, it should be confirmed beforehand whether the
solvent will dissolve the package and/or the glass lid or not.
Document Number: 001-02366 Rev. *D
Page 37 of 40
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