IBIS4-A-6600 Datasheet, PDF (36/40 Pages) Cypress Semiconductor – 6.6 MP CMOS Image Sensor

ADVANCE
INFORMATION
IBIS4-A-6600
CYII4SM6600AB
Bonding of the IBIS4-A-6600 in the 68-pin LCC Package
Figure 29. Bonding Scheme of the IBIS4-A-6600 in the LCC Package
The middle of the die corresponds with the middle of the
package cavity (± 50 µm).
Pixel 0,0 is located at x = –4023 µm, y = –4806 µm
(mechanical centre of the die/package is x = 0, y = 0).
Document Number: 001-02366 Rev. *D
Page 36 of 40
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