IBIS4-A-6600 Datasheet, PDF (34/40 Pages) Cypress Semiconductor – 6.6 MP CMOS Image Sensor

ADVANCE
INFORMATION
IBIS4-A-6600
CYII4SM6600AB
Figure 27. Package Side View (all dimensions in inch)
Table 21. Package Side View Dimensions.
Dimension
A
B
C
D
E
F
G
Description
Glass (thickness)
Die - Si (thickness)
Die attach (thickness)
Glass attach (thickness)
Imager to lid-outer surface
Imager to lid-inner surface
Imager to seating plane of pkg
Min.
0.037
0.002
0.002
0.060
Inch
Typ.
0.039
0.029
0.004
0.004
0.081
0.039
0.061
Max.
0.039
0.006
0.006
0.062
Min.
0.950
0.030
0.030
1.512
(mm)
Typ.
1.000
0.740
0.060
0.070
2.048
0.978
1.562
Max.
1.050
0.090
0.110
1.612
D
E
A
F
G
C
B - Die
Document Number: 001-02366 Rev. *D
Page 34 of 40
[+] Feedback