HMC703LP4E Datasheet, PDF (11/58 Pages) Hittite Microwave Corporation – 8 GHZ FRACTIONAL SYNTHESIZER

Outline Drawing
v02.0813
HMC703LP4E
8 GHz fractional synthesizer
NOTES:
[1] PACKAGE BODY MATERIAL: LOW STRESS INJECTION MOLDED PLASTIC SILICA AND SILICON IMPREGNATED.
[2] LEAD AND GROUND PADDLE MATERIAL: COPPER ALLOY.
[3] LEAD AND GROUND PADDLE PLATING: 100% MATTE TIN.
[4] DIMENSIONS ARE IN INCHES [MILLIMETERS].
[5] LEAD SPACING TOLERANCE IS NON-CUMULATIVE.
[6] PAD BURR LENGTH SHALL BE 0.15mm MAX. PAD BURR HEIGHT SHALL BE 0.05mm MAX.
[7] PACKAGE WARP SHALL NOT EXCEED 0.05mm
[8] ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF GROUND.
[9] REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED PCB LAND PATTERN.
Table 4. Package Information
Part Number
Package Body Material
Lead Finish
HMC703LP4E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn
[1] 4-Digit lot number XXXX
[2] Max peak reflow temperature of 260°C
MSL Rating
MSL1^[2]
Package Marking ^[1]
H703
XXXX
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