W83877TF Datasheet, PDF (95/154 Pages) Winbond – I/O chip disk drive adapter

W83877TF
W83877TD (100-pin LQFP)
100
1
HD
D
81
80
E HE
30
31
51
e
b
50
See Detail F
Seating Plane
A2 A
A1
y
c
θ
L
L1
Detail F
Dimension in inches Dimension in mm
Symbol
Min. Nom. Max. Min. Nom. Max.
A
A1
0.002 0.004 0.006 0.05 0.10 0.15
A2
0.053 0.055 0.057 1.35 1.40 1.45
b
0.009 0.013 0.015 0.22 0.32 0.38
c
0.004 0.006 0.008 0.10 0.15 0.20
D
E
e
HD
HE
L
0.547
0.783
0.020
0.626
0.862
0.018
0.551
0.787
0.026
0.630
0.866
0.024
0.555
0.791
0.032
0.634
0.870
0.030
13.90
19.90
0.498
15.90
21.90
0.45
14.00
20.00
0.65
16.00
22.00
0.60
14.10
20.10
0.802
16.10
22.10
0.75
L1
0.039
1.00
y
0.003
0.08
θ
0
7
0
7
Notes:
1. Dimension D & E do not include interlead
flash.
2. Dimension b does not include dambar
protrusion/intrusion.
3. Controlling dimension: Millimeters
4. General appearance spec. should be based
on final visual inspection spec.
Headquarters
No. 4, Creation Rd. III
Science-Based Industrial Park
Hsinchu, Taiwan
TEL: [phone]
FAX: [phone]
www: http://www.winbond.com.tw/
Taipei Office
11F, No. 115, Sec. 3, Min-Sheng East Rd.
Taipei, Taiwan
TEL: [phone]
FAX: [phone]
TLX: 16485 WINTPE
Winbond Electronics (H.K.) Ltd.
Rm. 803, World Trade Square, Tower II
123 Hoi Bun Rd., Kwun Tong
Kowloon, Hong Kong
TEL: [phone]
FAX: [phone]
Winbond Electronics
(North America) Corp.
2730 Orchard Parkway
San Jose, CA 95134 U.S.A.
TEL: [phone]
FAX: [phone]
Please note that all data and specifications are subject to change without
notice. All the trade marks of products and companies mentioned in this data
sheet belong to their respective owners.
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Publication Release Date: March 1998
Version 0.61