W958D6DB Datasheet, PDF (55/57 Pages) Winbond – Low-power features

W958D6DB
256Mb Async./Burst/Sync./A/D MUX
11. PACKAGE DESCRIPTION
11.1 Package Dimension
54 Ball VFBGA (6X8 mm^2,ball pitch:0.75mm, Ø =0.4mm)
Note:
1. Ball land:0.45mm. Ball opening:0.35mm.
PCB ball land suggested <=0. 35 mm
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Publication Release Date : June 27 ,2013
Revision : A01-003