TA1360AFG_05 Datasheet, PDF (24/110 Pages) Toshiba Semiconductor – YCbCr/YPbPr Signal and Sync Processor for Digital TV, Progressive Scan TV and Double Scan TV

Maximum Ratings (Ta = 25°C)
TA1360AFG
Characteristics
Symbol
Rating
Unit
Power supply voltage (pins 16, 45, 75)
Power supply voltage (pin 31)
Input pin voltage
Power dissipation
Power dissipation reduction rate
depending on temperature
Operating temperature
Storage temperature
Supply voltage (pins 16, 45 and 75)
V_CCmax9
V_CCmax2
V_in
P_D (Note 3)
1/θja
T_opr
T_stg
min
typ.
max
12
2.5
GND − 0.3 to V_CC + 0.3
2604
20.8
−20 to 65
−20 to 70
−55 to 150
8.7
8.5
9.0
8.8
9.3
9.1
V
V
V
mW
mW/°C
°C
°C
V
Note 3: See the following Figure A. (With device mounted on a PCB whose dimensions are 114.3 mm × 76.2 mm ×
1.6 mm and whose surface is 20% copper. Mount the device on a PCB of at least these dimensions and
whose surface is at least 20% copper.)
When using in −25 to 70°C of operating temperature, set the IC’s power supply voltage (pins 16, 45, 75) to
8.8 V (±0.3 V).
When designing a set, make sure that the IC can radiate heat because the TA1360AFG has low thermal
capacity. Note that the power dissipation varies greatly according to conditions of a board.
2604
1771
1667
0
0
25
65 70
150
Ambient temperature Ta (°C)
Figure A Power Dissipation Reduction Curve
24
2005-08-18