CDC960 Datasheet, PDF (16/38 Pages) Texas Instruments – 200-MHz CLOCK SYNTHESIZER/DRIVER WITH SPREAD SPECTURM CAPABILITY AND DEVICE CONTROL INTERFACE

CDC960
200ĆMHz CLOCK SYNTHESIZER/DRIVER
WITH SPREAD SPECTRUM CAPABILITY AND DEVICE CONTROL INTERFACE
SCAS675 – APRIL 2002
absolute maximum ratings over operating free-air temperature (unless otherwise noted)^†
Supply voltage range, V_DD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 4.6 V
Input voltage range, V_I (see Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to V_DD + 0.5 V
Voltage range applied to any output in the high-impedance state or power-off state,
V_O (see Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to V_DD + 0.5 V
Current into any output in the low state, I_O . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 × rated I_OL
Input clamp current:
I_IK (V_I < 0) _{. .} . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –18 mA
I_IK (V_I > V_DD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 mA
Output clamp current: I_OK (V_O < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –50 mA
I_OK (V_O > V_DD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA
Package thermal impedance, θ_JA (see Note 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95°C/W
Maximum power dissipation at T_A = 55°C (in still air) (see Note 5) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.0 W
Operating free-air temperature range, T_A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0°C to 70°C
Storage temperature range, T_stg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C
† _{Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and}
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 3. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
4. The package thermal impedance is calculated in accordance with EIA/JEDEC Std JESD51, except for the through-hole packages,
which use a trace length of zero. The absolute maximum power dissipation allowed at TA = 55^°C (in still air) is 1.0 W.
5. The maximum package power dissipation is calculated using a junction temperature of 150_C and a board trace length of 750 mils.
For more information, refer to the Package Thermal Considerations application note in the ABT Advanced BiCMOS Technology Data
Book, literature number SCBD002.
DISSIPATION RATING TABLE
PACKAGE
TA ≤ 25°C
POWER RATING
OPERATING FACTOR^‡
ABOVE TA = 25°C
TA = 70°C
POWER RATING
DL
1.3 W
10.7 mW/°C
0.85 W
‡ _{This is the inverse of the traditional junction-to-case thermal resistance (RθJA) and uses a}
board-mounted device at 95°C/W.
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