SI5344H-42H Datasheet, PDF (52/56 Pages) Silicon Laboratories – HIGH-FREQUENCY,

Si5344H/42H
9. PCB Land Pattern
Figure 26 illustrates the PCB land pattern details for the devices. Table 21 lists the values for the dimensions
shown in the illustration.
Figure 26. PCB Land Pattern
Table 21. PCB Land Pattern Dimensions
Dimension
C1
C2
Millimeters (Max)
6.90
6.90
E
0.50
X1
0.30
Y1
0.85
X2
5.30
Y2
5.30
Notes:
General
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. This Land Pattern Design is based on the IPC-7351 guidelines.
3. All dimensions shown are at Maximum Material Condition (MMC). Least Material
Condition is calculated based on a fabrication Allowance of 0.05 mm.
Solder Mask Design
4. All metal pads are to be non-solder mask defined (NSMD). Clearance between the
solder mask and the metal pad is to be 60 µm minimum, all the way around the pad.
Stencil Design
5. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should
be used to assure good solder paste release.
6. The stencil thickness should be 0.125 mm (5 mils).
7. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pads.
8. A 3x3 array of 1.25 mm square openings on 1.80 mm pitch should be used for the
center ground pad.
Card Assembly
9. A No-Clean, Type-3 solder paste is recommended.
10. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification
for Small Body Components.
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