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E202075_HD404889 Datasheet, PDF (18/202 Pages) Renesas Technology Corp – Low-Voltage AS Microcomputers with On-Chip LCD Circuit
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HD404889/HD404899/HD404878/HD404868 Series
Pad Coordinates
HCD404878
Y
Mold
Chip center
(X=0,Y=0)
Chip size (X × Y): 4.13 × 4.26 (mm)
Coordinates:
Pad center
Home point position: Chip center
Pad size (X × Y): 90 × 90 (µm)
Chip thickness:
280 (µm)
X
Pad No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
Pad name
R70
R71
R72
R73
R80
R81
TEST
OSC1
OSC2
GND
X2
X1
RESETN
VCC
D0/INT0N
D1/INT1
D2
D3
D4
D5
D6
D7
D8
D9
D10
D11
R00/WU0N
R01/WU1N
R02/WU2N
R03/WU3N
R10/EVNB
R11/EVND
R12/BUZZ
R13/TOB
R20/TOC
R21/SCKN
R22/Si/SO
R23
R30/SEG1
Coodinates
X (µm)
–1879
–1879
–1879
–1879
–1879
–1879
–1879
–1879
–1879
–1879
–1879
–1879
–1879
–1879
–1879
–1879
–1879
–1879
–1654
–1488
–1322
–1155
–989
–823
–656
–490
–324
–158
9
175
341
508
674
840
1007
1173
1339
1506
1879
Y (µm)
1446
1280
1114
948
781
615
449
282
116
–73
–239
–406
–572
–738
–905
–1071
–1237
–1404
–1943
–1943
–1943
–1943
–1943
–1943
–1943
–1943
–1943
–1943
–1943
–1943
–1943
–1943
–1943
–1943
–1943
–1943
–1943
–1943
–1571
Pad No.
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
Pad name
R31/SEG2
R32/SEG3
R33/SEG4
R40/SEG5
R41/SEG6
R42/SEG7
R43/SEG8
R50/SEG9
R51/SE10
R52/SEG11
R53/SEG12
R60/SEG13
R61/SEG14
R62/SEG15
R63/SEG16
SEG17
SEG18
SEG19
SEG20
SEG21
SEG22
SEG23
SEG24
SEG25
SEG26
SEG27
SEG28
SEG29
SEG30
SEG31
SEG32
COM1
COM2
COM3
COM4
V3
V2
V1
V0
Coodinates
X (µm)
1879
1879
1879
1879
1879
1879
1879
1879
1879
1879
1879
1879
1879
1879
1879
1879
1879
1879
1879
1509
1351
1192
1033
874
716
557
398
239
81
–78
–237
–411
–570
–728
–887
–1038
–1194
–1351
–1507
Y (µm)
–1405
–1239
–1072
–906
–740
–573
–407
–241
–74
92
258
425
591
757
924
1087
1246
1405
1564
1943
1943
1943
1943
1943
1943
1943
1943
1943
1943
1943
1943
1943
1943
1943
1943
1943
1943
1943
1943
16
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