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MT40A512M16HA-083EIT Datasheet, PDF (330/373 Pages) Micron Technology – Programmable data strobe preambles
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8Gb: x4, x8, x16 DDR4 SDRAM
Current Specifications – Limits
24. The IDD values must be derated (increased) when operated outside of the range 0°C ≤ TC
≤ 85°C:
When TC < 0°C: IDD2P0, IDD2P1, and IDD3P must be derated by 6%; IDD4R and IDD4W must be
derated by 4%; IDD6, IDD6ET, and IDD7 must be derated by 11%.
When TC > 85°C: IDD0, IDD1, IDD2N, IDD2NT, IDD2Q, IDD3N, IDD3P, IDD4R, IDD4W, and IDD5R must
be derated by 3%; IDD2Px must be derated by 40%.
25. IPP6x is applicable to IDD6N, IDD6E, IDD6R and IDD6A conditions.
Table 148: IDD, IPP, and IDDQ Current Limits; Die Rev. B
Symbol
Width
IDD0: One bank ACTIVATE-to- x4
PRECHARGE current
x8
x16
IPP0: One bank ACTIVATE-to- x4, x8
PRECHARGE IPP current
x16
IDD1: One bank ACTIVATE-to- x4
READto- PRECHARGE current x8
x16
IDD2N: Precharge standby
current
x4, x8
x16
IDD2NT: Precharge standby
ODT current
x4, x8
x16
IDD2P: Precharge power-
down current
x4, x8
x16
IDD2Q: Precharge quiet stand- x4, x8
by current
x16
IDD3N: Active standby current x4
x8
x16
IPP3N: Active standby IPP cur- ALL
rent
IDD3P: Active power-down
x4
current
x8
x16
IDD4R: Burst read current
x4
x8
x16
IDD4W: Burst write current
x4
x8
x16
IDD5R: Burst refresh current
(1X REF)
x4, x8
x16
DDR4-2133
40
45
75
3
4
52
57
95
33
33
45
67
25
25
30
30
35
40
44
3
30
35
39
100
125
225
95
115
213
50
56
DDR4-2400
43
48
80
3
4
55
60
100
34
34
50
75
25
25
30
30
38
43
47
3
32
37
41
110
135
243
103
123
228
53
59
DDR4-2666
46
51
85
3
4
58
63
105
35
35
50
75
25
25
30
30
41
46
50
3
34
39
43
121
146
263
112
132
244
56
61
DDR4-2933
49
54
90
3
4
61
66
110
36
36
55
78
25
25
30
30
44
49
53
3
36
41
45
132
157
283
121
141
261
59
64
DDR4-3200
52
57
95
3
4
64
69
115
37
37
60
81
25
25
30
30
47
52
56
3
38
43
47
143
168
302
130
150
278
62
67
Unit
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
09005aef861d1d4a
8gb_ddr4_dram.pdf - Rev. G 1/17 EN
330
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