MT40A512M16HA-083EIT Datasheet, PDF (28/373 Pages) Micron Technology – Programmable data strobe preambles

Package Dimensions
8Gb: x4, x8, x16 DDR4 SDRAM
Package Dimensions
Figure 7: 78-Ball FBGA – x4, x8 (PM)
0.155
Seating plane
78X Ø0.47
Dimensions apply
to solder balls
post-reflow on
Ø0.42 SMD ball pads.
13.2 ±0.1
9.6 CTR
0.8 TYP
1.8 CTR
Nonconductive
overmold
A
0.12 A
987
321
A
B
C
D
E
F
G
H
J
K
L
M
N
Ball A1 ID
(covered by SR)
Ball A1 ID
0.8 TYP
1.1 ±0.1
6.4 CTR
0.28 MIN
9 ±0.1
Notes: 1. All dimensions are in millimeters.
2. Solder ball material: SAC302 (96.8% Sn, 3% Ag, 0.2% Cu).
09005aef861d1d4a
8gb_ddr4_dram.pdf - Rev. G 1/17 EN
28
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