PIC24FJ256GA110_10 Datasheet, PDF (270/330 Pages) Microchip Technology – 64/80/100-Pin, 16-Bit, General Purpose Flash Microcontrollers with Peripheral Pin Select

PIC24FJ256GA110 FAMILY
28.1 DC Characteristics
FIGURE 28-1:
PIC24FJ256GA110 FAMILY VOLTAGE-FREQUENCY GRAPH (INDUSTRIAL)
3.00V
2.75V
2.75V
2.50V
2.25V
2.00V
PIC24FJXXXGA1XX
2.25V
16 MHz
Frequency
32 MHz
For frequencies between 16 MHz and 32 MHz, FMAX = (64 MHz/V) * (VDDCORE – 2V) + 16 MHz.
Note 1: When the voltage regulator is disabled, VDD and VDDCORE must be maintained so that
VDDCORE  VDD  3.6V.
TABLE 28-1: THERMAL OPERATING CONDITIONS
Rating
PIC24FJ256GA110 Family:
Operating Junction Temperature Range
Operating Ambient Temperature Range
Power Dissipation:
Internal Chip Power Dissipation:
PINT = VDD x (IDD –  IOH)
I/O Pin Power Dissipation:
PI/O =  ({VDD – VOH} x IOH) +  (VOL x IOL)
Maximum Allowed Power Dissipation
Symbol Min
Typ
Max Unit
TJ
-40
—
+140
°C
TA
-40
—
+125
°C
PD
PINT + PI/O
W
PDMAX
(TJ – TA)/JA
W
TABLE 28-2: THERMAL PACKAGING CHARACTERISTICS
Characteristic
Symbol Typ Max Unit Notes
Package Thermal Resistance, 14x14x1 mm TQFP
JA
50.0
—
°C/W (Note 1)
Package Thermal Resistance, 12x12x1 mm TQFP
JA
69.4
—
°C/W (Note 1)
Package Thermal Resistance, 10x10x1 mm TQFP
JA
76.6
—
°C/W (Note 1)
Package Thermal Resistance, 9x9x0.9 mm QFN
JA
28.0
—
°C/W (Note 1)
Note 1: Junction to ambient thermal resistance, Theta-JA (JA) numbers are achieved by package simulations.
DS39905E-page 270
 2010 Microchip Technology Inc.