TC1796 Datasheet, PDF (130/134 Pages) Infineon Technologies AG – 32-Bit Single-Chip Microcontroller TriCore

5
Package and Reliability
TC1796
Package and Reliability
5.1
Package Parameters (P/PG-BGA-416-4)
Table 35 Thermal Characteristics of the Package
Parameter
Symbol
Min.
Values
Typ. Max.
Unit Note /
Test Condi
tion
Thermal resistance junction R_TJCT CC –
case top¹⁾
8
K/W –
Thermal resistance junction R_TJCB CC –
case bottom¹⁾
15
K/W –
1) The top and bottom thermal resistances between the case and the ambient (R_TCAT, R_TCAB) are to be combined
with the thermal resistances between the junction and the case given above (R_TJCT, R_TJCB), in order to calculate
the total thermal resistance between the junction and the ambient (R_TJA). The thermal resistances between the
case and the ambient (R_TCAT, R_TCAB) depend on the external system (PCB, case) characteristics, and are under
user responsibility.
The junction temperature can be calculated using the following equation: T_J = T_A + R_TJA × P_D, where the R_TJA
is the total thermal resistance between the junction and the ambient. This total junction ambient resistance R_TJA
can be obtained from the upper four partial thermal resistances.
Data Sheet
130
V1.0, 2008-04