TC1796 Datasheet, PDF (104/134 Pages) Infineon Technologies AG – 32-Bit Single-Chip Microcontroller TriCore

TC1796
Electrical Parameters
4.2.6
???
Power Supply Current
Table 21 Power Supply Currents (Operating Conditions apply)
Parameter
Symbol
Values
Unit Note /
Min. Typ. Max.
Test Condition
PORST low current at I_{DD_PORST}
– – 300 mA The PLL running at
V_DD
CC
the base frequency
PORST low current at I_{DDP_PORST} –
–
25
mA The PLL running at
V_DDP, and PORST high
CC
the base frequency
current without any port
activity
Active mode core
supply current¹⁾²⁾
I_DD
10 –
CC
Active mode analog
supply current
I_DDAx;
––
I_DDMx
CC
Stand-by RAM supply I_SBSB
––
current in stand-by
CC
Oscillator and PLL core
I 3)
DDOSC
––
power supply
CC
700 mA f_CPU=150MHzf_CPU/f
SYS ^{= 2:1}
–
mA See ADC0/1
FADC
9
mA V_DDSB = 1V,
T_j = 150^oC
5
mA –
Oscillator and PLL pads I_DDOSC3
– – 3.6 mA –
power supply
CC
LVDS port supply
(via V_DDP)⁴⁾
Flash power supply
current
I_LVDS
– – 50 mA LVDS pads active
CC
I_DDFL3
– – 80 mA –
CC
Maximum Allowed
P_D
Power Dissipation⁵⁾
– – P_D × – worst case
SR
R_TJA
T_A = 125^oC
<
25^oC
1) Infineon Power Loop: CPU and PCP running, all peripherals active. The power consumption of each custom
application will most probably be lower than this value, but must be evaluated separately.
2) The I_DD decreases for typically 120 mA if the f_CPU is decreased for 50 MHz, at constant T_J = 150C, for the
Infineon Max Power Loop.
The dependency in this range is, at constant junction temperature, linear.
3) V_DDOSC and V_SSOSC are not bonded externally in the BC and BD steps of TC1796. An option for bonding them
in future steps and products is kept open.
4) In case the LVDS pads are disabled, the power consumption pro pair is negligible (less than 1µA).
5) For the calculation of junction to ambient thermal resistance R_TJA, see Page 130.
Data Sheet
104
V1.0, 2008-04