RF60 Datasheet, PDF (24/157 Pages) –

RF60 CRYSTAL-LESS SOC TRANSMITTER v1.0
Table 6.1. PCB Land Pattern Dimensions
Dimension
C1
E
X1
Y1
Notes:
MIN
MAX
5.30
5.40
1.27 BSC
0.50
0.60
1.45
1.55
General
1. All dimensions shown are in millimeters (mm) unless otherwise
noted.
2. This land pattern design is based on the IPC-7351 guidelines.
Solder Mask Design
1. All metal pads are to be non-solder mask defined (NSMD).
Clearance between the solder mask and the metal pad is to be 60 m
minimum, all the way around the pad.
Stencil Design
1. A stainless steel, laser-cut and electro-polished stencil with
trapezoidal walls should be used to assure good solder paste release.
2. The stencil thickness should be 0.125mm (5 mils).
3. The ratio of stencil aperture to land pad size should be 1:1 for
all perimeter pads.
Card Assembly
1. A No-Clean, Type-3 solder paste is recommended.
2. The recommended card reflow profile is per the JEDEC/IPC J-STD-
020 specification for Small Body Components
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