MSC8112 Datasheet, PDF (41/44 Pages) Freescale Semiconductor, Inc – Dual Core Digital Signal Processor

Ordering Information
4 Ordering Information
Consult a Freescale Semiconductor sales office or authorized distributor to determine product availability and place an order.
Part
Package Type
Core
Voltage
Operating
Temperature
Core
Frequency
(MHz)
Order Number
Lead-Free
Lead-Bearing
MSC8112 Flip Chip Plastic Ball Grid Array (FC-PBGA)
1.1 V
–40° to 105°C
300
MSC8112TVT2400V MSC8112TMP2400V
5 Package Information
Notes:
1. All dimensions in millimeters.
2. Dimensioning and tolerancing
per ASME Y14.5M–1994.
3. Features are symmetrical about
the package center lines unless
dimensioned otherwise.
4. Maximum solder ball diameter
measured parallel to Datum A.
5. Datum A, the seating plane, is
determined by the spherical
crowns of the solder balls.
6. Parallelism measurement shall
exclude any effect of mark on
top surface of package.
7. Capacitors may not be present
on all devices.
8. Caution must be taken not to
short capacitors or exposed
metal capacitor pads on
package top.
9. FC CBGA (Ceramic) package
code: 5238.
FC PBGA (Plastic) package
code: 5263.
10.Pin 1 indicator can be in the
form of number 1 marking or an
“L” shape marking.
Figure 35. MSC8112 Mechanical Information, 431-pin FC-PBGA Package
MSC8112 Dual Core Digital Signal Processor Data Sheet, Rev. 0
Freescale Semiconductor
41