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MSC8112 Datasheet, PDF (15/44 Pages) Freescale Semiconductor, Inc – Dual Core Digital Signal Processor
Electrical Characteristics
Table 5. DC Electrical Characteristics
Characteristic
Symbol
Min
Typical
Max
Unit
Input high voltage1, all inputs except CLKIN
Input low voltage1
VIH
2.0
—
3.465
V
VIL
GND
0
0.8
V
CLKIN input high voltage
VIHC
2.4
3.0
3.465
V
CLKIN input low voltage
VILC
GND
0
0.8
V
Input leakage current, VIN = VDDH
IIN
–1.0
0.09
1
µA
Tri-state (high impedance off state) leakage current, VIN = VDDH
IOZ
–1.0
0.09
1
µA
Signal low input current, VIL = 0.8 V2
IL
–1.0
0.09
1
µA
Signal high input current, VIH = 2.0 V2
IH
–1.0
0.09
1
µA
Output high voltage, IOH = –2 mA,
except open drain pins
VOH
2.0
3.0
—
V
Output low voltage, IOL= 3.2 mA
VCCSYN PLL supply current
Internal supply current:
• Wait mode
• Stop mode
Typical power 300 MHz at 1.1 V4
VOL
—
IVCCSYN
—
0
0.4
V
2
4
mA
IDDW
—
3753
—
mA
IDDS
—
2903
—
mA
P
—
554
—
mW
Notes: 1. See Figure 5 for undershoot and overshoot voltages.
2. Not tested. Guaranteed by design.
3. Measured for 1.1 V core at 25°C junction temperature.
4. The typical power values were calculated using a power calculator configured for two cores performing an EFR code with the
device running at the specified operating frequency and a junction temperature of 25°C. No peripherals were included. The
calculator was created using CodeWarrior® 2.5. These values are provided as examples only. Power consumption is
application dependent and varies widely. To assure proper board design with regard to thermal dissipation and maintaining
proper operating temperatures, evaluate power consumption for your application and use the design guidelines in Chapter 4 of
this document and in MSC8102, MSC8122, and MSC8126 Thermal Management Design Guidelines (AN2601).
VIH
VDDH + 17%
VDDH + 8%
VDDH
VIL
GND
GND – 0.3 V
GND – 0.7 V
Must not exceed 10% of clock period
Figure 5. Overshoot/Undershoot Voltage for VIH and VIL
MSC8112 Dual Core Digital Signal Processor Data Sheet, Rev. 0
Freescale Semiconductor
15