MC68HC705K1 Datasheet, PDF (137/140 Pages) Freescale Semiconductor, Inc – HCMOS Microcontroller Unit

Freescale Semiconductor, Inc.
Technical Data — MC68HC705K1
Section 13. Ordering Information
13.1 Contents
13.2 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .137
13.3 MCU Order Numbers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .137
13.2 Introduction
This section contains ordering information for the available package
types.
13.3 MCU Order Numbers
Table 13-1 lists the MC order numbers.
Table 13-1. MC68HC705K1 Order Numbers
Package Type
16-pin plastic dual in-line package (PDIP)
16-pin small outline integrated circuit (SOIC)
16-pin ceramic dual in-line package (cerdip)
16-pin plastic dual in-line package (PDIP)
16-pin small outline integrated circuit (SOIC)
16-pin ceramic dual in-line package (cerdip)
1. P = Plastic dual in-line package (PDIP)
2. DW = Small outline integrated circuit (SOIC)
3. S = Ceramic dual in-line package (cerdip)
4. C = Extended temperature range (–40°C to +85°C)
Temperature Range
0°C to +70°C
0°C to +70°C
0°C to +70°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
Order Number
MC68HC705K1P⁽¹⁾
MC68HC705K1DW⁽²⁾
MC68HC705K1S⁽³⁾
MC68HC705K1CP⁽⁴⁾
MC68HC705K1CDW
MC68HC705K1CS
MC68HC705K1 — Rev. 2.0
Ordering Information
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Technical Data