MC68HC705K1 Datasheet, PDF (135/140 Pages) Freescale Semiconductor, Inc – HCMOS Microcontroller Unit

Freescale Semiconductor, Inc.
Mechanical Specifications
Ceramic Dual In-Line Package (Case 620)
13.5 Ceramic Dual In-Line Package (Case 620)
B
A
16
B
1
E
F
A
M
9
L
8
16X J
0.25 (0.010) M T B
C
K
N
T
SEATING
PLANE
G
16X D
0.25 (0.010) M T A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
INCHES
MILLIMETERS
DIM MIN MAX MIN MAX
A 0.750 0.785 19.05 19.93
B 0.240 0.295 6.10 7.49
C ––– 0.200 ––– 5.08
D 0.015 0.020 0.39 0.50
E
0.050 BSC
1.27 BSC
F 0.055 0.065 1.40 1.65
G 0.100 BSC
2.54 BSC
H 0.008 0.015 0.21 0.38
K 0.125 0.170 3.18 4.31
L
0.300 BSC
7.62 BSC
M
0_ 15_ 0_ 15_
N 0.020 0.040 0.51 1.01
STYLE 1:
PIN 1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
15.
16.
CATHODE
CATHODE
CATHODE
CATHODE
CATHODE
CATHODE
CATHODE
CATHODE
ANODE
ANODE
ANODE
ANODE
ANODE
ANODE
ANODE
ANODE
MC68HC705K1 — Rev. 2.0
Mechanical Specifications
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Technical Data