MC68HC705K1 Datasheet, PDF (133/140 Pages) Freescale Semiconductor, Inc – HCMOS Microcontroller Unit

Freescale Semiconductor, Inc.
Technical Data — MC68HC705K1
Section 13. Mechanical Specifications
13.1 Contents
13.2 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .133
13.3 Plastic Dual In-Line Package (Case 648) . . . . . . . . . . . . . . . .134
13.4 Small Outline Integrated Circuit (Case 751) . . . . . . . . . . . . . .134
13.5 Ceramic Dual In-Line Package (Case 620) . . . . . . . . . . . . . .135
13.2 Introduction
Package dimensions available at the time of this publication for the
MC68HC705K1 are provided in this section. The packages are:
• 16-pin plastic dual in-line package (PDIP)
• 16-pin small outline integrated circuit package (SOIC)
• 16-pin ceramic DIP (cerdip)
To make sure that you have the latest case outline specifications,
contact one of the following:
• Local Motorola Sales Office
• Motorola Mfax
– Phone [phone]
– EMAIL [e-mail]
• Worldwide Web (wwweb) at http://www.mcu.motsps.com
Follow Mfax or wwweb on-line instructions to retrieve the current
mechanical specifications.
MC68HC705K1 — Rev. 2.0
Mechanical Specifications
For More Information On This Product,
Go to: www.freescale.com
Technical Data