MC68HC705C9A Datasheet, PDF (107/118 Pages) Motorola, Inc – Microcontrollers

Chapter 13
Mechanical Specifications
13.1 Introduction
This section describes the dimensions of the plastic dual in-line package (DIP), plastic shrink dual in-line
package (SDIP), plastic leaded chip carrier (PLCC), and quad flat pack (QFP) MCU packages.
The following figures show the latest package drawings at the time of this publication. To make sure that
you have the latest package specifications, contact your local Freescale Sales Office.
13.2 40-Pin Plastic Dual In-Line (DIP) Package (Case 711-03)
40
1
H
A
G
F
21
B
20
C
N
D
K
SEATING
PLANE
L
J
M
NOTES:
1. POSITION TOLERANCE OF LEADS (D), SHALL
BEWITHIN 0.25 (0.010) AT MAXIMUM MATERIAL
CONDITIONS, IN RELATION TO SEATING PLANE
AND EACH OTHER.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
MILLIMETERS
DIM MIN MAX
A 51.69 52.45
B 13.72 14.22
C 3.94 5.08
D 0.36 0.56
F 1.02 1.52
G
2.54 BSC
H 1.65 2.16
J 0.20 0.38
K 2.92 3.43
L
15.24 BSC
M
0°
1°
N 0.51 1.02
INCHES
MIN MAX
2.035 2.065
0.540 0.560
0.155 0.200
0.014 0.022
0.040 0.060
0.100 BSC
0.065 0.085
0.008 0.015
0.115 0.135
0.600 BSC
0°
1°
0.020 0.040
Figure 13-1. 40-Pin Plastic DIP Package (Case 711-03)
MC68HC05C9A Advance Information Data Sheet, Rev. 4.1
Freescale Semiconductor
107