MC3630 Datasheet, PDF (7/83 Pages) –

MC3630 3-Axis Accelerometer
Preliminary Datasheet
Recommended soldering profile
The LGA package is qualified for soldering heat resistance according to IPC/JEDEC J-TD-020,
“Joint industry Standards:Moisture/Reflow Sensitivity Classification for non-hermetic Solid State surface
Mount Devices”.
Shipping and handling is qualified according to IPC/JEDEC J-STD-033,
“Joint Industry Standard:Handling,Packing,Shipping and Use of Moisture/Reflow Sensitive Surface
Mount Devices”
Recommendations:
 Store the carrier tape and reel in the dry pack unopened until required on the assembly floor.
 If the product reel has been removed from the dry pack, reseal the product reel inside the dry
pack with a black protective belt to avoid crushing the carrier tape from the reel.
 Store the pizza box in the vertical position.
Table 3, Figure 3, Table 4 and notes are referenced from IPC/JEDEC J-TD-020.
Profile Feature
Preheat/Soak
Temperature Min (T_smin)
Temperature Max (T_smax)
Time (t_s) from (T_smin to T_smax)
Ramp-up rate (T_L to T_p)
Liquidous temperature (T_L)
Time (t_L) maintained above T_L
Peak package body temperature (T_p)
Time (t_p)^* within 5^oC of the specified classification temperature (T_c), see
Figure 3
Pb-Free Assembly
150 ^oC
200 ^oC
60 – 120 seconds
3 ^oC/second max.
217 ^oC
60 – 150 seconds
For users T_p must not exceed the Classification temperature listed in Pb-Free
Process Table in Table 4
For suppliers T_p must equal or exceed the Classification temperature listed in
Pb-Free Process Table in Table 4
30^* seconds
Ramp-down rate (T_p to T_L)
6^oC/second max.
Time 25^oC to peak temperature
8 minutes max.
*Tolerance for peak profile temperature (T_p) is defined as a supplier minimum and a user maximum
Table 3. Classification Reflow Profiles
Note 1: All temperatures refer to the center of the package, measured on the package body surface that is facing up during assembly reflow (e.g., live-bug). If
parts are reflowed in other than the normal live-bug assembly reflow orientation (i.e., dead-bug), Tp shall be within ± 2 °C of the live-bug Tp and still
meet the Tc requirements, otherwise, the profile shall be adjusted to achieve the latter. To accurately measure actual peak package body temperatures
refer to JEP140 for recommended thermocouple use.
Note 2: Reflow profiles in this document are for classification/preconditioning and are not meant to specify board assembly profiles. Actual board assembly
profiles should be developed based on specific process needs and board designs and should not exceed the parameters in Table 3.
For example, if Tc is 260 °C and time tp is 30 seconds, this means the following for the supplier and the user.
For a supplier: The peak temperature must be at least 260 °C. The time above 255 °C must be at least 30 seconds.
For a user: The peak temperature must not exceed 260 °C. The time above 255 °C must not exceed 30 seconds.
Note 3: All components in the test load shall meet the classification profile requirements.
Note 4: SMD packages classified to a given moisture sensitivity level by using Procedures or Criteria defined within any previous version of J-STD-020,
JESD22-A112 (rescinded), IPC-SM-786 (rescinded) do not need to be reclassified to the current revision unless a change in classification level or a higher peak
classification temperature is desired.
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