EPF10K30E Datasheet, PDF (47/100 Pages) Altera Corporation – Embedded Programmable Logic Device

FLEX 10KE Embedded Programmable Logic Devices Data Sheet
Generic Testing
Each FLEX 10KE device is functionally tested. Complete testing of each
configurable static random access memory (SRAM) bit and all logic
functionality ensures 100% yield. AC test measurements for FLEX 10KE
devices are made under conditions equivalent to those shown in
Figure 21. Multiple test patterns can be used to configure devices during
all stages of the production flow.
Figure 21. FLEX 10KE AC Test Conditions
Power supply transients can affect AC
measurements. Simultaneous transitions of
multiple outputs should be avoided for
accurate measurement. Threshold tests
must not be performed under AC
conditions. Large-amplitude, fast-ground-
current transients normally occur as the
703 Ω
[481 Ω ]
Device
Output
device outputs discharge the load
capacitances. When these transients flow
through the parasitic inductance between
the device ground pin and the test system
ground, significant reductions in
observable noise immunity can result.
Numbers in brackets are for 2.5-V devices
8.06 kΩ
[481 Ω ]
Device input
rise and fall
times < 3 ns
or outputs. Numbers without brackets are
for 3.3-V. devices or outputs.
VCCIO
Test
System
C1 (includes
JIG capacitance)
Operating
Conditions
Tables 19 through 23 provide information on absolute maximum ratings,
recommended operating conditions, DC operating conditions, and
capacitance for 2.5-V FLEX 10KE devices.
Table 19. FLEX 10KE 2.5-V Device Absolute Maximum Ratings Note (1)
Symbol
Parameter
Conditions
Min
Max Unit
V_CCINT Supply voltage
With respect to ground (2)
–0.5
3.6
V
V _CCIO
–0.5
4.6
V
V_I
DC input voltage
–2.0
5.75
V
I _OUT
DC output current, per pin
–25
25
mA
T_STG Storage temperature
No bias
–65
150
°C
T_AMB Ambient temperature
Under bias
–65
135
°C
T_J
Junction temperature
PQFP, TQFP, BGA, and FineLine BGA
packages, under bias
135
°C
Ceramic PGA packages, under bias
150
°C
Altera Corporation
47