Z8F082ASJ020EG Datasheet, PDF (262/282 Pages) Zilog, Inc. – High-Performance 8-Bit Microcontrollers

Z8 Encore! XP^® F082A Series
Product Specification
245
Packaging
Zilog’s Product Line of MCUs includes the Z8F011A, Z8F012A, Z8F021A, Z8F022A,
Z8F041A, Z8F042A, Z8F081A and Z8F082A devices, which are available in the follow-
ing packages:
• 8-pin Plastic Dual-Inline Package (PDIP)
• 8-Pin Quad Flat No-Lead Package (QFN)/MLF-S¹
• 8-pin Small Outline Integrated Circuit Package (SOIC)
• 20-pin Small Outline Integrated Circuit Package (SOIC)
• 20-pin Small Shrink Outline Package (SSOP)
• 20-pin Plastic Dual-Inline Package (PDIP)
• 28-pin Small Outline Integrated Circuit Package (SOIC)
• 28-pin Small Shrink Outline Package (SSOP)
• 28-pin Plastic Dual-Inline Package (PDIP)
Current diagrams for each of these packages are published in Zilog’s Packaging Product
Specification (PS0072), which is available free for download from the Zilog website.
1. The footprint of the QFN)/MLF-S package is identical to that of the 8-pin SOIC package, but with a lower profile.
PS022827-1212
PRELIMINARY
Packaging