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MSP430F673X Datasheet, PDF (81/121 Pages) Texas Instruments – MIXED SIGNAL MICROCONTROLLER
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MSP430F673x
MSP430F672x
SLAS731A – DECEMBER 2011 – REVISED APRIL 2012
Flash Memory
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST
CONDITIONS
MIN TYP
DVCC(PGM/ERASE) Program and erase supply voltage
IPGM
Average supply current from DVCC during program
IERASE
Average supply current from DVCC during erase
IMERASE, IBANK
tCPT
Average supply current from DVCC during mass erase or bank erase
Cumulative program time
See (1)
Program/erase endurance
1.8
3
104
105
tRetention
tWord
tBlock, 0
Data retention duration
Word or byte program time
Block program time for first byte or word
TJ = 25°C
100
See (2)
64
See (2)
49
tBlock, 1–(N–1)
Block program time for each additional byte or word, except for last
byte or word
See (2)
37
tBlock, N
Block program time for last byte or word
See (2)
55
tErase
Erase time for segment erase, mass erase, and bank erase when
available
See (2)
23
fMCLK,MGR
MCLK frequency in marginal read mode
(FCTL4.MGR0 = 1 or FCTL4. MGR1 = 1)
0
MAX UNIT
3.6 V
5 mA
8 mA
5 mA
16 ms
cycles
years
85 µs
65 µs
49 µs
73 µs
32 ms
1 MHz
(1) The cumulative program time must not be exceeded when writing to a 128-byte flash block. This parameter applies to all programming
methods: individual word- or byte-write and block-write modes.
(2) These values are hardwired into the flash controller's state machine.
JTAG and Spy-Bi-Wire Interface
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST
CONDITIONS
MIN TYP
fSBW
tSBW,Low
tSBW, En
Spy-Bi-Wire input frequency
Spy-Bi-Wire low clock pulse length
Spy-Bi-Wire enable time (TEST high to acceptance of first clock
edge) (1)
2.2 V, 3 V
2.2 V, 3 V
2.2 V, 3 V
0
0.025
tSBW,Rst
fTCK
Spy-Bi-Wire return to normal operation time
TCK input frequency for 4-wire JTAG(2)
15
2.2 V
0
3V
0
Rinternal
Internal pulldown resistance on TEST
2.2 V, 3 V
45
60
MAX UNIT
20 MHz
15 µs
1 µs
100 µs
5
MHz
10
80 kΩ
(1) Tools accessing the Spy-Bi-Wire interface need to wait for the minimum tSBW,En time after pulling the TEST/SBWTCK pin high before
applying the first SBWTCK clock edge.
(2) fTCK may be restricted to meet the timing requirements of the module selected.
Copyright © 2011–2012, Texas Instruments Incorporated
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